| Industry | 制造业 | ||||||||||||||||||||||||
| Company Introduction | 公司是一家专业从事高端电子封装材料研发及产业化的国家级专精特新重点“小巨人”企业，产品形态为电子级粘合剂和功能性薄膜材料，广泛应用于集成电路封装、智能终端封装和新能源应用等新兴产业领域，按照应用领域、应用场景不同，公司主要产品包括集成电路封装材料、智能终端封装材料、新能源应用材料、高端装备应用材料四大类别。 公司是国家集成电路产业基金重点布局的电子封装材料生产企业，在国家高层次海外引进人才领衔的核心团队长期钻研下，公司在集成电路封装、智能终端封装、动力电池封装、光伏叠瓦封装等领域实现技术突破，并已在高端电子封装材料领域构建起了完整的研发生产体系并拥有完全自主知识产权。截至2021年12月31日，公司拥有国家级海外高层次专家人才2人，研发人员81人，研发人员占总人数的比例为14.24%。公司及子公司先后承担了多项国家级、省部级重大科研项目。 公司坚持自主可控、高效布局业务策略，聚焦集成电路、智能终端、新能源等战略新兴产业核心和“卡脖子”环节关键材料的技术开发和产业化，并与行业领先客户建立长期合作关系，以满足下游应用领域前沿需求并提供创新性解决方案。 | ||||||||||||||||||||||||
| Main Business | 高端电子封装材料的研发及产业化，产品形态为电子级粘合剂和功能性薄膜材料，可实现结构粘接、导电、导热、绝缘、保护、电磁屏蔽等复合功能 | ||||||||||||||||||||||||
| Legal Representative | 解海华 | ||||||||||||||||||||||||
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| Company Secretary | 于杰 | ||||||||||||||||||||||||
| Solicitors | 北京植德律师事务所 | ||||||||||||||||||||||||
| Auditors | 永拓会计师事务所（特殊普通合伙） | ||||||||||||||||||||||||
| Tel No | 0535-3469988;0535-3467732 | ||||||||||||||||||||||||
| Fax No | 0535-3469923 | ||||||||||||||||||||||||
| Website | www.darbond.com | ||||||||||||||||||||||||
| dbkj@darbond.com | |||||||||||||||||||||||||
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| Listing Date | 19/09/2022 | ||||||||||||||||||||||||
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| EPS(RMB)* | ¥ 0.720 | ||||||||||||||||||||||||
| DPS(RMB)* | ¥ 0.250 | ||||||||||||||||||||||||
| NBV Per Share(RMB)* | ¥ 15.962 | ||||||||||||||||||||||||
| Market Capitalization(RMB) | 3.295B |
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| * | Unadjusted Data |
| Information provided by: etnet | ||
| Terms and Conditions | ||
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