Industry | 制造业 | ||||||||||||||||||||||||
Company Introduction | 公司系经盛美有限整体变更发起设立的股份有限公司。2019年10月30日,盛美有限董事会决议通过,公司名称变更为“盛美半导体设备(上海)股份有限公司”,以2019年8月31日为改制基准日整体变更为股份有限公司。2019年10月30日,盛美有限全体股东作为发起人签署了《发起人协议》,约定盛美有限以经立信会计师审计的截至2019年8月31日的净资产55,289.00万元为基础,按1:0.6740的比例折为372,649,808股股份,其余18,024.02万元计入资本公积,股份有限公司注册资本为37,264.98万元。 2019年11月15日,公司在上海自由贸易试验区管理委员会办理外商投资企业变更备案,并取得《外商投资企业变更备案回执》。 2019年11月21日,公司取得上海市市场监督管理局签发的营业执照(统一社会信用代码:91310000774331663A)。 立信会计师对整体变更后的注册资本实收情况进行了审验,并出具“信会师报字[2020]第ZI10024号”《验资报告》,确认截至2019年11月14日,发起人出资额已按时足额缴纳。 盛美成立于2005年,是一家注册在上海浦东新区张江高科技园区、具备世界领先技术的半导体设备制造商。公司集研发、设计、制造、销售于一体,主要产品包括半导体清洗设备、半导体电镀设备和先进封装湿法设备等。公司坚持差异化竞争和创新的发展战略,通过自主研发的单片兆声波清洗技术、单片槽式组合清洗技术、电镀技术、无应力抛光技术和立式炉管技术等,向全球晶圆制造、先进封装及其他客户提供定制化的设备及工艺解决方案,有效提升客户的生产效率、提升产品良率并降低生产成本。 盛美具有高新技术企业资质,承担十一五国家科技重大专项课题“65-45nm铜互连无应力抛光设备研发项目”的研发和十二五国家科技重大专项课题“20-14nm铜互连镀铜设备研发与应用”和“45-22纳米单片晶圆清洗装备研发与应用”的研发。公司立足自主创新,通过多年的技术研发和工艺积累,成功研发出全球首创的SAPS/TEBO兆声波清洗技术和Tahoe单片槽式组合清洗技术,可应用于28nm及以下技术节点的晶圆清洗领域,可有效解决刻蚀后有机沾污和颗粒的清洗难题,并大幅减少浓硫酸等化学试剂的使用量,在帮助客户降低生产成本的同时,满足节能减排的要求。 盛美凭借先进的技术和丰富的产品线,已发展成为中国大陆少数具有一定国际竞争力的半导体专用设备提供商,产品得到众多国内外主流半导体厂商的认可,并取得良好的市场口碑。 | ||||||||||||||||||||||||
Main Business | 从事半导体专用设备的研发、生产和销售 | ||||||||||||||||||||||||
Legal Representative | HUI WANG | ||||||||||||||||||||||||
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Company Secretary | 罗明珠 | ||||||||||||||||||||||||
Solicitors | 北京市金杜律师事务所 | ||||||||||||||||||||||||
Auditors | 立信会计师事务所(特殊普通合伙) | ||||||||||||||||||||||||
Tel No | 021-50808868;021-50276506 | ||||||||||||||||||||||||
Fax No | 021-50808860 | ||||||||||||||||||||||||
Website | www.acmrcsh.com.cn | ||||||||||||||||||||||||
ir@acmrcsh.com | |||||||||||||||||||||||||
Company Address |
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Listing Date | 18/11/2021 | ||||||||||||||||||||||||
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EPS(RMB)* | ¥ 2.090 | ||||||||||||||||||||||||
DPS(RMB)* | ¥ 0.626 | ||||||||||||||||||||||||
NBV Per Share(RMB)* | ¥ 14.822 | ||||||||||||||||||||||||
Market Capitalization(RMB) | 8.776B |
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* | Unadjusted Data |
Information provided by: etnet | ||
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