Industry | 制造业 | ||||||||||||||||||||||||
Company Introduction | 公司是集成电路高端先进封装测试服务商,目前聚焦于显示驱动芯片领域,具有领先的行业地位。公司主营业务以前段金凸块制造(GoldBumping)为核心,并综合晶圆测试(CP)及后段玻璃覆晶封装(COG)和薄膜覆晶封装(COF)环节,形成显示驱动芯片全制程封装测试综合服务能力。公司的封装测试服务主要应用于LCD、AMOLED等各类主流面板的显示驱动芯片,所封装测试的芯片系日常使用的智能手机、智能穿戴、高清电视、笔记本电脑、平板电脑等各类终端产品得以实现画面显示的核心部件。 公司是中国境内最早具备金凸块制造能力,及最早导入12吋晶圆金凸块产线并实现量产的显示驱动芯片先进封测企业之一,具备8吋及12吋晶圆全制程封装测试能力。2020年度,公司显示驱动芯片封装出货量在全球显示驱动芯片封测领域排名第三,在中国境内排名第一,具有较强的市场竞争力。 公司在显示驱动芯片封装测试领域深耕多年,凭借先进的封测技术、稳定的产品良率与优质的服务能力,积累了丰富的客户资源。公司服务的客户包括联咏科技、天钰科技、瑞鼎科技、奇景光电等全球知名显示驱动芯片设计企业,所封测芯片已主要应用于京东方、友达光电等知名厂商的面板。2020年度全球排名前五显示驱动芯片设计公司中三家系公司主要客户,2020年度中国排名前十显示驱动芯片设计公司中九家系公司主要客户。 公司经过多年持续的研发投入及技术沉淀,形成了微间距驱动芯片凸块制造技术、凸块高可靠性结构及工艺、高精度晶圆研磨薄化技术、高稳定性晶圆切割技术、晶圆高精度稳定性测试技术等多项核心技术,目前已授权专利达259项,在行业内具有技术领先优势。公司围绕集成电路封装测试的行业特性,在生产工艺及生产装置等环节持续研发改进,追求高精度、高良率、高可靠性的封装测试核心能力,为显示驱动芯片的大批量国产化应用奠定了坚实的技术基础。 公司以成为国内领先、世界一流的高端芯片封装测试服务商为愿景,以提升中国集成电路产业的全球竞争力为使命。未来,公司将积极扩充12吋大尺寸晶圆的先进封装测试服务能力,保持行业及产品的领先地位,同时将进行持续的研发投入,不断拓宽封测服务的产品应用领域,积极拓展以CMOS影像传感器、车载电子等为代表的新兴产品领域。 | ||||||||||||||||||||||||
Main Business | 以前段金凸块制造(GoldBumping)为核心,并综合晶圆测试(CP)及后段玻璃覆晶封装(COG)和薄膜覆晶封装(COF)环节,形成显示驱动芯片全制程封装测试综合服务能力。 | ||||||||||||||||||||||||
Legal Representative | 郑瑞俊 | ||||||||||||||||||||||||
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Company Secretary | 奚勰 | ||||||||||||||||||||||||
Solicitors | 安徽天禾律师事务所 | ||||||||||||||||||||||||
Auditors | 天健会计师事务所(特殊普通合伙) | ||||||||||||||||||||||||
Tel No | 0551-67139968-7099 | ||||||||||||||||||||||||
Fax No | 0551-67139968-7099 | ||||||||||||||||||||||||
Website | www.unionsemicon.com.cn | ||||||||||||||||||||||||
zhengquan@unionsemicon.com.cn | |||||||||||||||||||||||||
Company Address |
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Listing Date | 18/08/2022 | ||||||||||||||||||||||||
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EPS(RMB)* | ¥ 0.230 | ||||||||||||||||||||||||
DPS(RMB)* | ¥ 0.100 | ||||||||||||||||||||||||
NBV Per Share(RMB)* | ¥ 3.752 | ||||||||||||||||||||||||
Market Capitalization(RMB) | 5.327B |
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* | Unadjusted Data |
Information provided by: etnet | ||
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