Industry | 制造业 | ||||||||||||||||||||||||
Company Introduction | 公司主要从事集成电路的封装和测试业务,为集成电路设计企业提供集成电路封装与测试解决方案,并收取封装和测试服务加工费。公司封装产品主要包括“高密度细间距凸点倒装产品(FC类产品)、系统级封装产品(SiP)、晶圆级封装产品(Bumping及WLP)、扁平无引脚封装产品(QFN/DFN)、微机电系统传感器(MEMS)”5大类别。下游客户主要为集成电路设计企业,产品主要应用于射频前端芯片,AP类SoC芯片,触控芯片、WiFi芯片、蓝牙芯片、MCU等物联网AIOT芯片、电源管理芯片、计算类芯片、工业类和消费类产品等领域。 公司于2017年11月设立,从成立之初即聚焦集成电路封测业务中的先进封装领域,车间洁净等级、生产设备、产线布局、工艺路线、技术研发、业务团队、客户导入均以先进封装业务为导向。报告期内,公司全部产品均为QFN、LGA、BGA、FlipChip、Bumping、WLCSP等中高端先进封装形式,并在系统级封装(SiP)、高密度细间距凸点倒装产品(FC类产品)、大尺寸/细间距扁平无引脚封装产品(QFN/DFN)、Bumping/WLP等先进封装领域具有较为突出的工艺优势和技术先进性。 公司为了保持先进封装技术的先进性和竞争优势,在技术研发和产品开发布局上,一方面注重与先进晶圆工艺制程发展相匹配,另一方面注重以客户和市场需求导向为目标。结合半导体封测领域前沿技术发展趋势,以及物联网、5G、人工智能、大数据等应用领域对集成电路芯片的封测需求,公司陆续完成了倒装和焊线类芯片的系统级混合封装技术、5纳米晶圆倒装技术等技术的开发,并成功实现稳定量产。同时,公司已经掌握了系统级封装电磁屏蔽(EMIShielding)技术、芯片表面金属凸点(Bumping)技术、Fan-in技术,并积极开发Fan-out、2.5D/3D等晶圆级封装技术、高密度系统级封装技术、大尺寸FC-BGA封装技术等,为公司未来业绩可持续发展积累了较为深厚的技术储备。 | ||||||||||||||||||||||||
Main Business | 从事集成电路的封装和测试业务,为集成电路设计企业提供集成电路封装与测试解决方案,并收取封装和测试服务加工费。 | ||||||||||||||||||||||||
Legal Representative | 王顺波 | ||||||||||||||||||||||||
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Company Secretary | 李大林 | ||||||||||||||||||||||||
Solicitors | 上海市锦天城律师事务所 | ||||||||||||||||||||||||
Auditors | 天健会计师事务所(特殊普通合伙) | ||||||||||||||||||||||||
Tel No | 0574-58121888-6786 | ||||||||||||||||||||||||
Fax No | 0574-62089985 | ||||||||||||||||||||||||
Website | www.forehope-elec.com | ||||||||||||||||||||||||
zhengquanbu@forehope-elec.com | |||||||||||||||||||||||||
Company Address |
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Listing Date | 16/11/2022 | ||||||||||||||||||||||||
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EPS(RMB)* | ¥ -0.230 | ||||||||||||||||||||||||
DPS(RMB)* | -- | ||||||||||||||||||||||||
NBV Per Share(RMB)* | ¥ 6.006 | ||||||||||||||||||||||||
Market Capitalization(RMB) | 7.644B |
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* | Unadjusted Data |
Information provided by: etnet | ||
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